朱福龙

姓名:朱福龙

电话:13554049469

职称:副教授

邮箱:zhufulong2@sina.com

个人基本情况

    朱福龙(Zhu Fulong,Associate Professor男,1974年生,江西省新干县人,华中科技大学机械学院博士、副教授;研究方向为微/纳制造,微米/纳米力学,微电子封装可靠性。攻读博士期间获得华中科技大学第六届“研究生科技十佳”称号等多项荣誉,博士学位论文被评为华中科技大学“校优秀博士论文”。2007年留校参加工作以来,先后参与国家自然基金、863、973、02专项课题多项,现主持部委课题、863项目子课题各一项、发表论文30余篇,申请与授权专利9项,软件版权2项。

主要研究方向

微/纳制造

微米/纳米力学

微电子封装可靠性

开设课程

功能材料基础

近年的科研项目、专著与论文、专利、获奖

获得软件版权:

1.封装材料数据库系统   V1.0    2004SR11907(登记号)

2.MEMS封装模拟与仿真库V1.0    2005SR04366(登记号)


获得专利:

1. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海.“一种基于投影莫尔原理的共面度测量系统”.发明专利.专利号:ZL 2010 1 0548868.7

2. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海. “一种基于投影莫尔原理的BGA共面度测量系统”. 发明专利.专利号:ZL 2010 1 0548877.6

3. 朱福龙,宋劭,张伟,刘胜.“一种利用分形理论优化加热结构的环境加热炉”.实用新型专利.专利号:ZL 2011 2 0031410.4

4. 朱福龙,宋劭,张伟,刘胜.“一种用于微电子封装材料测试的环境加热炉”.实用新型专利.专利号:ZL 2011 2 0031369.0

5. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海. “一种基于投影莫尔原理的BGA共面度测量系统”. 实用新型专利.专利号:ZL 2010 2 0612724.9

6. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海.“一种基于投影莫尔原理的共面度测量系统”. 实用新型专利.专利号:ZL 2010 2 0612694.1

7. 王志勇, 刘胜, 张鸿海, 史铁林, 汪海英, 汪学方, 朱福龙. “一种用于微小样品的六轴力学性能测量装置”. 实用新型专利.专利号:ZL03237264.7

8.张鸿海,刘华勇,舒霞云,徐裕力,肖峻峰,朱福龙,张丰,王永先.“一种高粘度流体微量喷射点胶装置”. 实用新型专利. 专利号:ZL200720088827.8

9. 张鸿海,刘华勇,舒霞云,徐裕力,肖峻峰,朱福龙,张丰,王永先.“一种高粘度流体微量喷射点胶装置”. 发明专利. 专利号:ZL200710168669.1


承担的科研项目:

  1. 项目名称:气密MEMS封装工艺及规范 任务来源:国家863计划项目(2002AA430030)起止年月:2002.12-2003.12

  2. 项目名称:封装材料特性测试及数据库 任务来源:国家863计划项目MEMS重大专项(2003AA404016)起止年月:2003.6-2004.12

  3. 项目名称:面向石化等重要行业MEMS压力传感器制造与实用化研究  务来源:国家863计划项目(2004AA404221)起止年月:2004.10-2005.12

  4. 项目名称:低成本、高性能真空熔焊封装关键技术与装备的研究  任务来源:国家863计划项目(2005AA404260)止年月:2005.7-2006.6

  5. 项目名称:基于荷花效应的MEMS功能表面仿生研究  任务来源:国家自然基金项目(50475137)起止年月:2005.01-2007.12

  6. 项目名称:基于电磁流体动力学的金属焊料微喷射技术的研究  任务来源:国家自然基金项目(50775087)起止年月:2008.01-2010.12

  7. 项目名称:系统级封装的基础研究-热管理与热应力 务来源:国家973项目子课题(2009CB320203)起止年月:2009.02-2013.2

  8. 项目名称:汽车胎压微传感器及系统  任务来源:国家863计划项目子课题  起止年月:2008.06-2010.1

  9. 项目名称:高密度三维系统封装关键技术研究 任务来源:国家02重大专项课题(2009ZX02038)起止年月:2010.01-2012.12

  10. 项目名称:先进封装工艺开发及产业化  任务来源:国家02重大专项课题(2009ZX02024-09)起止年月:2010.01-2012.12

  11. 项目名称:基于TSV的三维封装关键技术 务来源:国家02重大专项课题 起止年月:2010.01-2012.12

  12. 项目名称:MEMS器件规模封装技术基础研究 任务来源:国家02重大专项课题 起止年月:2010.9-2015.09

  13. 项目名称:异质微结构表面差异性同步去除与晶圆减薄新原理 任务来源:国家973项目子课题(2015CB057203)起止年月:2015.1-2019.12


主持科研项目:

  1. 项目名称:关键封装设备、材料应用工程-封装翘曲测量设备的研发和产业化  任务来源:国家02重大专项课题(2009ZX02010-041)起止年月:2010.01-2012.12

  2. 项目名称:碳纳米管增强无铅互连焊点的界面可靠性研究 任务来源:中央高校基本科研业务费资助项目(2011TS066)起止年月:2011.6-2012.12

  3. 项目名称:振动对航电产品电连接器的接触电阻影响分析研究  任务来源:航空基金(20120279004)起止年月:2012.10-2014.10

  4. 项目名称:微振动条件下航电产品电连接器的接触可靠性研究  任务来源:中央高校基本科研业务费资助项目(2013TS023)起止年月:2013.6-2014.12

  5. 项目名称:基于声光效应的超声功率测量技术研究  任务来源:企业委托研究项目(2011TS066)起止年月:2013.6-2014.12

  6. 项目名称:第三代半导体封装和系统失效机理与可靠性快速寿命方法研究--材料模型建立,数据处理方法开发(华科子课题) 任务来源:国家863计划项目子课题 起止年月:2015.01-2017.12


获奖情况:

获奖项目:系统封装、测试的若干关键技术及装备 奖项级别:电子信息技术奖(二等)授奖部门:中国电子学会 获奖年月:2009.12

获奖项目:系统封装、测试的若干关键技术及装备 奖项级别:科技发明一等奖;授奖部门:中国物流与采购联合会 获奖年月:2009.11

获奖项目:高精度一维测试台结构设计及试验 奖项级别:湖北省优秀学士学位论文-指导教师;授奖部门:湖北省教育厅、学位办 获奖年月:2009.2

获奖项目:胶囊内窥镜的磁导航式运动检测台设计 奖项级别:湖北省优秀学士学位论文-指导教师;授奖部门:湖北省教育厅、学位办 获奖年月:2010.2

获奖项目:微型胶囊机器人结构设计 项级别:湖北省优秀学士学位论文-指导教师;授奖部门:湖北省教育厅、学位办 获奖年月:2012.12


发表的主要论文(通讯作者*):

[1]     Wei Zhang, Fulong Zhu*, Honghai Zhang, et al. An Adjustable Sensitivity Shadow Moiré Technique for Surface Morphology Measurement. Journal of Modern Optics, 2014, 61(8): 641-649. ( SCI收录, B类期刊)

[2]     Wei Zhang, Fulong Zhu*, Yiquan Dai, et al. Warpage measurement of silicon wafers of various bonding areas. 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 2012. 1164-1167. (EI收录)

[3]     Wei Zhang, Fulong Zhu, Shao Song, et al. 3-D warpage measurement of silicon wafe.  2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce (AIMSEC), Deng Leng, 2011. 3603-3605. (EI收录)


[4]     Ying Li, Fulong Zhu*, Yanming Chen, Ke Duan, Kai Tang, Sheng Liu,”Analysis of insertion force of electric connector based on FEM”,21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA2014)(EI)


[5]     Ke Duan, Fulong Zhu*, Ying Li, Kai Tang, Sheng Liu, Yanming Chen,”Contact Resistance Investigation of Electrical Connector with Different Shrink Range” , The 15th International Conference on Electronic Packaging Technology (ICEPT 2014).(EI)

[6]     Ke Duan, Fulong Zhu*, Mingxiang Chen, Ying Li, Yanming Chen,”, Warpage Analysis of DBC Substrate based on Non-contact Shadow Moiré Technology”, The 15th International Conference on Electronic Packaging Technology (ICEPT 2014).(EI)


[7]     Kai Tang, Fulong Zhu*, Ying Li, Ke Duan, Sheng Liu, Yanming Chen,”Effect of Defects on Thermal Conductivity of Graphene” The 15th International Conference on Electronic Packaging Technology (ICEPT 2014).(EI)

[8]     Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li,  Hengyou Liao,  Sheng Liu, “Molecular Dynamics Simulation on Thermal Conductivity of Single-Walled Carbon Nanotubes”, The 14th International Conference on Electronic Packaging Technology (ICEPT 2013).(EI)

[9]     Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li,  Hengyou Liao , Xiahui Chen, Sheng Liu, “Effect of Vacancy Defects on Thermal Conductivity of Single-walled Carbon Nanotube”, The 15th Electronics Packaging Technology Conference (EPTC 2013).(EI)


[10]Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “The effect of temperature on compressive mechanical behavior of SWCNT-Ni”, The 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012).(EI)

[11]Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “Compressing Deformation Investigation of Single-Walled Carbon Nanotube Coated with Ni”The 14th Electronics Packaging Technology Conference (EPTC 2012).(EI)(注:该论文获得了最佳海报论文奖)

[12]Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, “Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy”, The 14th International Conference on Electronic Packaging Technology (ICEPT 2013).(EI)

[13]Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu, “Mechanical Properties Investigation of Graphene Coated with Ni”The 15th Electronics Packaging Technology Conference (EPTC 2013).(EI)


[14]Hengyou Liao, Fulong Zhu*, Sheng Liu, “MECHANICAL STRETCHING BEHAVIOR SIMULATION OF SWCNT AND SWCNT-NI”, 2011 International Symposium on Advanced Packaging Materials (APM) Conference. (EI)

[15]Hengyou Liao, Fulong Zhu*, Wei Zhang, “Tensile behaviors investigation of SWCNT-Ni with vacancies”The 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012). (EI)

[16]Hengyou Liao, Fulong Zhu*, Wei Zhang, “Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics”. The 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012). (EI)


[17]Shao Song, Fulong Zhu*, Wei Zhang, Sheng Liu, “Warpage measurement of various substrates based on white light shadow Moiré technology”, 2011 International Microsystems, Packing, Assembly and Circuits Technology Conference(IMPACT 2011),Taipei, 2011. 389-392. (EI收录).(EI)


[18]Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu, “Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules”.2011 Electronic Components and Technology Conference(EI);

[19]Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Sheng Tao, “Mechanical Properties Investigation of PMMA PC and PS during Thermal Nanoimprinting”.The forth International Symposium on Precision Mechanical Measurements,Hefei,2008EI 

[20]Fulong Zhu*, Shao Song, Wei Zhang, Sheng Liu, “Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5”2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, p 195-198, 2010EI

[21]Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Microstructures and Tensile Properties of a Sn-Cu Lead-free Solder Alloy”, Journal of Materials Science: Materials in Electronics, 2006 17:385-390.EI,SCI

[22]Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “the Effect of Temperature and Strain Rate On the Tensile properties of a Sn99.3Cu0.7(Ni) Lead-free Solder Alloy”, Microelectronics Engineering, v84, n1, January, 2007, p144-150.EI,SCI

[23]Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Effects of Temperature and Strain Rate on Mechanical property of Sn96.5Ag3Cu0.5”, Journal of Alloys and Compounds, Volume 438, Issues 1-2, 12 July 2007, Pages 100-105. EI,SCI

[24]Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7, 6th International Conference on Electronics Packaging Technology, Shenzhen, China, Aug. 30 to Sep. 2nd, 2005.EI

[25]Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, “Mechanical Properties of a Lead-Free Solder Alloys”, Proceedings of 2005 International Conference on Asian Green Electronics,Shanghai,China, March 15-18, pp.107-112.EI, ISTP

[26]ZHU Fu-long*, WANG Zhi-yong, GUAN Rong-feng, WANG Xue-fang, ZHANG Hong-hai, LIU Sheng, “Single Axis Mini-Tester of Mechanical Property for Micro-Specimen”, The 3rd International Symposium on Instrumentation Science and Technology (ISIST2004),Aug.18-22, 2004, Xi’an, China, Vol.3, 0562-0568.ISTP

[27]Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5”, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits  (IPFA 2006),  3-7 July,  2006, Singapore.ISTP

[28]Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, Sheng Liu, “Mechanical properties investigation of a SnAg solder”, Proceedings of 2005 International conference on electronics packaging, TokyoJapanApril 13-15,2005, pp.208-213.

[29]Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Creep Behaviors of a Lead-free Solder Alloy Sn96.5Ag3.5”, 7th International Conference on Electronics Packaging Technology, Shanghai, China, Aug. 26-29, 2006. EI

[30]Rongfeng Guan, Fulong Zhu, Zhiyin Gan, Huang Dexiu , Sheng Liu, “Stress birefringence analysis of polarization maintaining optical fibers”, Optical fiber technology, v11, n3, July, 2005, p240-254.EI ,SCI

[31]Wang Zhiyong, Zhu Fulong, ZHANG Hong-hai, LIU Sheng, GUAN Rong-feng, “A Six-axis Mechanical Tester for Microspecimens”, The 3rd International Symposium on Instrumentation Science and Technology(ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0535-0540.ISTP

[32]Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Huang Dexiu, “Study on plasma cleaning and strength of wire bonding”, Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability( EPRL, Apr.,26-29, 2004 Shanghai,China,p65-71.EI,ISTP

[33]Guan Rongfeng, Gan Zhiyin, Zhu Fulong, Liu Sheng, Wang Xuefang, “A Study of Anodic Bonding for Die-Level Vacuum Packaging”, 7th International Conference on Electronics Packaging Technology, Shanghai, China, Aug. 26 -29, 2006. EI

[34]陈四海, 汪殿民, 朱福龙, 徐涌, 易新建. 微型柔性剪切应力传感器的制作研究. 传感器技术, 2005(8) , 81-85

[35]刘文明, 王志勇, 鲍剑斌, 汪学方, 关荣锋, 朱福龙, 刘胜. 微陀螺仪的真空回流真空封装工艺研究. 微细加工技术,April ,2006, p61-64EI