尹周平

姓名:尹周平

电话:027-87559654

职称:教授

邮箱:yinzhp@hust.edu.cn

个人基本情况

    尹周平(Yin Zhouping,Professor,男,1972年9月出生。现任华中科技大学机械科学与工程学院副院长、教授、博士生导师,教育部长江学者特聘教授,国家杰出青年基金获得者,数字制造装备与技术国家重点实验室副主任。2000年在华中科技大学获工学博士学位,博士论文获2003年全国优秀博士论文奖;2002年博后出站担任副教授;2004年破格晋升教授;2005年被聘为博士生导师、校特聘教授;2006年获国家杰出青年基金资助;2009年受聘教育部长江学者特聘教授;2013年入选科技部中青年科技创新领军人才;2014年获何梁何利青年创新奖。

    兼任湖北省人工智能学会常务理事、秘书长,中国人工智能学会智能机器人专业委员会委员、智能制造专业委员会委员,中国机械工程学会高级会员,ASME/IEEE会员,国家自然科学基金机械学科评审专家,973/863计划同行评议专家等;《Frontiers of Mechanical Engineering》编委、《振动、测试与诊断》编委、《IEEE Trans. On  Mechatronics》 Guest Editor, 《IEEE Trans. On Robotics & Automation》、《Computer-aided Design》、《中国科学》、《机械工程学报》等期刊审稿人。

    主持承担了国家自然科学基金重大/重点、973、863等国家级项目,在电子制造技术与装备、复杂产品数字建模与精密测量、RFID技术与应用等方面取得一系列创新性成果。已在“Computer-aided Design”、“ASME Transactions”、“IEEE Transactions”、《中国科学》等国内外权威期刊上发表一批高水平论文,SCI/EI收录100篇次,SCI引用300余次,出版专著3本,授权国家发明专利20余项。获国家技术发明二等奖、国家自然科学二等奖、国家科技进步二等奖各1项,获省部级奖励5项,荣获“中国青年科技奖”、“全国优秀博士后”、“教育部新世纪优秀人才”、“中国机械工程学会青年科技成就奖”等学术荣誉。


主要研究方向

电子制造技术与装备

数字化智能化制造技术


开设课程

本科生《机器人技术基础》、《柔性电子制造技术基础》

研究生《机器人学》、《先进制造工程学》

近年的科研项目、专著与论文、专利、获奖

主持了多项国家级重大项目,包括:

12010年,国家自然科学基金重点项目“柔性电子跨尺度喷印制造中的动力学行为与调控”,项目负责人。

22008年,国家重大基础研究计划(973)课题“高密度倒装键合中多物理量协同控制机制与实现”,项目负责人。

32005年,国家863计划重大项目课题“RFID标签封装设备开发与生产”,项目负责人。

 

获得的国家级奖励:

2013年,“高性能无线射频识别(RFID)标签制造核心装备”获国家技术发明二等奖(第一完成人)

2012年,“复杂曲面零件数字化制造的几何推理理论和方法”获国家自然科学二等奖(第三完成人)

2004年,“发动机类零件的快速测量、数字建模及面向制造的设计”获国家科技进步二等奖(第二完成人)

 

荣誉与奖励:

2014年获“何梁何利青年创新奖”

2013年入选科技部“中青年科技创新领军人才”

2009年受聘“教育部长江学者特聘教授”

2007年获“中国青年科技奖”

2006年获“国家杰出青年基金”

2005年获“全国优秀博士后”

2004年获“教育部新世纪优秀人才”

2003年获“全国优秀博士论文奖”

 

 

专利授权国家发明专利20余项,以下仅部分):

1、一种气动直线驱动的芯片拾取与翻转装置发明专利 ZL201110045760.0

2、一种采用凸轮传动的小行程精密模切装置发明专利 ZL201110415903.2

3、一种多带同步输送装置发明专利 ZL201010131560.2

4、一种可调压力摩擦输送对辊装置发明专利 ZL200910273410.2

5、一种自对心双支撑卡盘发明专利 ZL200910273409.X

6、一种芯片拾放控制方法及装置发明专利 ZL200910272685.4

7、一种热压头及由其组成的热压装置发明专利 ZL200910272540.4

8、一种卷到卷间歇式柔性基材传输的张力控制方法及装置发明专利 ZL200810048371.1

9、一种多路高精度温度控制器发明专利 ZL200710053106.8

10、一种四自由度倒装键合头发明专利 ZL200410061154.8


代表性著作:

[1] Y. Q. Zeng, B. Tao, and Z. P. Yin*, “Molecular orientation transformation of pentacene on amorphous SiO2: A computational study on the initial growth stage of physical vapor deposition,” Journal of Crystal Growth, vol. 405, pp. 73-80, Nov, 2014.

[2] Z. X. Liu, Y. A. Huang, Z. P. Yin*, S. Bennati, and P. S. Valvo, “A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints,” International Journal of Adhesion and Adhesives, vol. 54, pp. 112-123, Oct, 2014.

[3] Z. X. Liu, Y. A. Huang, H. M. Liu, J. K. Chen, and Z. P. Yin*, “Reliable Peeling of Ultrathin Die With Multineedle Ejector,” Ieee Transactions on Components Packaging and Manufacturing Technology, vol. 4, no. 9, pp. 1545-1554, Sep, 2014.

[4] Y. A. Huang, Y. Z. Wang, L. Xiao, H. M. Liu, W. T. Dong, and Z. P. Yin*, “Microfluidic serpentine antennas with designed mechanical tunability,” Lab on a Chip, vol. 14, no. 21, pp. 4205-4212, 2014.

[5] Y. A. Huang, Y. Q. Duan, Y. J. Ding, N. B. Bu, Y. Q. Pan, N. S. Lu, and Z. P. Yin*, “Versatile, kinetically controlled, high precision electrohydrodynamic writing of micro/nanofibers,” Scientific Reports, vol. 4, Aug, 2014.

[6] Y. Q. Duan, Y. A. Huang, Z. P. Yin*, N. B. Bu, and W. T. Dong, “Non-wrinkled, highly stretchable piezoelectric devices by electrohydrodynamic direct-writing,” Nanoscale, vol. 6, no. 6, pp. 3289-3295, 2014.[7] N. B. Bu, Y. A. Huang, Y. Q. Duan, and Z. P. Yin*, “Process Optimization of Mechano-Electrospinning by Response Surface Methodology,” Journal of Nanoscience and Nanotechnology, vol. 14, no. 5, pp. 3464-3472, May, 2014.

[8] G. H. Wu, B. Tao, and Z. P. Yin*, “Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions,” Microelectronics Reliability, vol. 53, no. 12, pp. 2030-2035, Dec, 2013.

[9] Y. Q. Pan, Y. A. Huang, N. B. Bu, and Z. P. Yin*, “Fabrication of Si-nozzles for parallel mechano-electrospinning direct writing,” Journal of Physics D-Applied Physics, vol. 46, no. 25, Jun, 2013.

[10]     Z. X. Liu, P. S. Valvo, Y. A. Huang, and Z. P. Yin*, “Cohesive failure analysis of an array of IC chips bonded to a stretched substrate,” International Journal of Solids and Structures, vol. 50, no. 22-23, pp. 3528-3538, Oct, 2013.

[11]     Y. Q. Duan, Y. A. Huang, and Z. P. Yin*, “Transfer printing and patterning of stretchable electrospun film,” Thin Solid Films, vol. 544, pp. 152-156, Oct, 2013.

[12]     N. B. Bu, Y. A. Huang, and Z. P. Yin*, "The Effect of Substrate on Continuous Electrohydrodynamic Printing," Advances in Applied Materials and Electronics Engineering Ii, Advanced Materials Research B. Gan, Y. Gan and Y. Yu, eds., pp. 352-356, Stafa-Zurich: Trans Tech Publications Ltd, 2013.

[13]     S. S. Zeng, X. J. Wan, W. L. Li, Z. P. Yin*, and Y. L. Xiong, “A novel approach to fixture design on suppressing machining vibration of flexible workpiece,” International Journal of Machine Tools & Manufacture, vol. 58, pp. 29-43, Jul, 2012.

[14]     B. Xiong, and Z. P. Yin*, “A Universal Denoising Framework With a New Impulse Detector and Nonlocal Means,” Ieee Transactions on Image Processing, vol. 21, no. 4, pp. 1663-1675, Apr, 2012.

[15]     N. B. Bu, Y. A. Huang, H. X. Deng, and Z. P. Yin*, “Tunable bead-on-string microstructures fabricated by mechano-electrospinning,” Journal of Physics D-Applied Physics, vol. 45, no. 40, Oct, 2012.

[16]     [16]  Z. P. Yin*, K. Mo, and Y. L. Xiong, “Defective point data reconstruction based on improved process of morphological operations,” Science China-Technological Sciences, vol. 54, no. 12, pp. 3166-3179, Dec, 2011.

[17]  B. Peng, Y. A. Huang, Z. P. Yin*, and Y. L. Xiong, “Analysis of interfacial peeling in IC chip pick-up process,” Journal of Applied Physics, vol. 110, no. 7, Oct, 2011.

[18]  Z. P. Yin*, Y. A. Huang, N. B. Bu, X. M. Wang, and Y. L. Xiong, “Inkjet printing for flexible electronics: Materials, processes and equipments,” Chinese Science Bulletin, vol. 55, no. 30, pp. 3383-3407, Oct, 2010.

[19]  J. B. Wu, Z. P. Yin*, and Y. L. Xiong, “The fast multilevel fuzzy edge detection of blurry images,” Ieee Signal Processing Letters, vol. 14, no. 5, pp. 344-347, May, 2007.

[20]  Z. P. Yin, H. Ding, H. X. Li, and Y. L. Xiong, “Geometric mouldability analysis by geometric reasoning and fuzzy decision making,” Computer-Aided Design, vol. 36, no. 1, pp. 37-50, Jan, 2004.

[21]  Z. P. Yin, H. Ding, H. X. Li, and Y. L. Xiong, “A connector-based hierarchical approach to assembly sequence planning for mechanical assemblies,” Computer-Aided Design, vol. 35, no. 1, pp. 37-56, Jan, 2003.

[22]  Z. P. Yin, H. Ding, and Y. L. Xiong, “Accessibility analysis in manufacturing processes using visibility cones,” Science in China Series E-Technological Sciences, vol. 45, no. 1, pp. 47-57, Feb, 2002.

[23]  Z. P. Yin, H. Ding, and Y. L. Xiong, “Virtual prototyping of mold design: geometric mouldability analysis for near-net-shape manufactured parts by feature recognition and geometric reasoning,” Computer-Aided Design, vol. 33, no. 2, pp. 137-154, Feb, 2001.

[24]  Z. P. Yin, H. Ding, and Y. L. Xiong, “Mouldability analysis for near-net-shaped manufactured parts using freedom cones,” International Journal of Advanced Manufacturing Technology, vol. 16, no. 3, pp. 169-175, 2000.

[25]   Z. P. Yin, H. Ding, and Y. L. Xiong, “Visibility theory and algorithms with application to manufacturing processes,” International Journal of Production Research, vol. 38, no. 13, pp. 2891-2909, Sep, 2000.

[26]《机器人操作》出版于湖北科学技术出版社,2002第二作者