朱福龙
  •       姓名:朱福龙

           电话:

           职称:教授

           邮箱:zhufulong2@sina.com  zhufulong@hust.edu.cn

     

     

  •  

个人基本情况

    朱福龙(Zhu Fulong,Professor男,1974年生,江西新干县人,华中科技大学机械科学与工程学院博士、教授、博士生导师19986月于武汉理工大学汽车学院获学士学位,20036月于华中科技大学工程力学系获硕士学位,20076月于华中科技大学机械科学与工程学院获机械工程博士学位, 2007年进入华中科技大学机械科学与工程学院从事教学与科研工作;主要研究方向为:微纳制造,微纳米力学,微电子封装可靠性、微纳米测试与测量;近年来主持及参与的项目包括02重大专项子课题、国家自然科学基金、科技部863计划项目子课题、国家重点基础研究发展计划(973计划)、航空基金、军民融合课题、国家电网委托课题等;发表学术论文50余篇(SCIEI检索40余篇),获中国发明专利4项、软件版权4项,目前被邀请担任Polymers, Journal of adhesion science and technologyReview of Scientific InstrumentsJournal of Electronic Materials, Computational Materials Science, Journal of Modern Optics, Journal of Materials Science: Materials in Electronics, Journal of Applied Physics等国际期刊审稿人

欢迎机械、力学、材料、物理等相关专业方向同学报考硕士和博士研究生,要求学生勤奋、踏实,富有科研探索和团队合作精神,主动性强、执行力强、表达能力强。

主要研究方向

微纳制造

微纳米力学

微电子封装可靠性

微纳米测试与测量

 

开设课程

特种加工(秋季-本科生)

微电子制造技术(秋季-本科生)

机械制造装备技术(春季-本科生)

微纳制造技术基础(秋季-研究生)

 

近年的科研项目、专著与论文、专利、获奖

 

发表的主要论文(通讯作者*)

[1] Fulong Zhu*, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu, “Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique”, IEEE Access, v6, p33099-33110, 2018. (SCI, EI, DOI:10.1109/ACCESS. 2018. 2842199)

[2] Yixin Xu, Fulong Zhu*, Miaocao Wang, Xiaojian Liu, Sheng Liu, “Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures”, in 19th International Conference on Electronic Packaging Technology, ICEPT 2018.

[3] Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu, “Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics”, in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, p434-437, 2018. (EI, DOI:10.23919/ICEP. 2018. 8374341)

[4] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Jiaquan Tao, Xinxin Lin, Fengren Wang and Lang Shi, “Investigation of mechanical properties of silicone/phosphor composite used in light emitting diodes package”, Polymers, v10, n2, p195, 2018. (SCI,EI, DOI: 10.3390/polym10020195)

[5] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiajie Fan and Sheng Liu, “Comparison of Ultrasonic Wire Bonding Process between Gold and Copper by Nonlinear Structure Analysis”, Journal of Adhesion Science and Technology, v32, n18, p 2007-2018, 2018. (SCI.EI, DOI: 10.1080/01694243.2018.1463651)

[6] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiaquan Tao, Liping He, Han Wang, Sheng Liu, “Comparing the copper and gold wire bonding during thermalsonic wire bonding process”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p 240-243, 2016. (EI, DOI: 10.1109/ICEPT. 2016. 7583127)

[7] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Jiaquan Tao and Sheng Liu, “Thermal-mechanical analysis of high power LED packaging during power cycling test”, 2017 18th International Conference on Electronic Packaging Technology, ICEPT 2017, p1-5, 2017. (EI, DOI: 10.1109/ICEPT.2017.8046394)

[8] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Fengren Wang, Lang Shi, Yan Kan and Sheng Liu, “Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated test”, in 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017, p1-4, 2017. (EI, DOI: 10.1109/EPTC.2017.8277431)

[9] Xinxin Lin, Fulong Zhu*, Liping He, Yongjun Pan, Jiaquan Tao, Ke Duan, “Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT2016, p417-420, 2016 (EI, DOI:10.1109/ICEPT. 2016.7583166).

[10] Zhu Fulong*, Kan Yan, Kan Tang, Sheng Liu, “Investigation of Thermal Properties of Ni-Coated Graphene Nanoribbons Based on Molecular Dynamics Methods”, Journal of Electronic Materials, v46, n8, p.4733-4739, 2017.(SCI,EI, DOI: 10.1007/s11664-017-5542-5)

[11] Liping He, Fulong Zhu*, Yanming Chen, Ke Duan, Xinxin Lin, Yongjun Pan, Jianquan Tao, “Ultrasonic power measurement system based on acousto-optic interaction”, Review of Scientific Instruments, v87, n5, p1-8, 2016.(SCI,EI, DOI: 10.1063/1.4948731)

[12] Liping He, Fulong Zhu*, Yuhong Liu, Sheng Liu, “Investigaton of machining mechanism of monocrystalline silicon in nanometric grinding”, AIP Advances, Vol.7, Issue 5, 2017. (SCI, EI, DOI: 10.1063/1.4983216)

[13] Liping He, Fulong Zhu*Ke DuanKai Tang, Sheng Liu, “Mechanical response of copper nanowires under torsion”, in 2015 16th International Conference on Electronic Packaging Technology, ICEPT2015, p318-322, 2015. (EI, DOI: 10.1109/ICEPT. 2015. 7236600)

[14] Fulong Zhu*, Hengyou Liao, Kai Tang, Youkai Chen, Sheng Liu, “Molecular dynamics study on the effect of temperature on the tensile properties of single-walled carbon nanotubes with a Ni-coating”, Journal of Nanomaterials, v 2015, 2015(SCI, EI, DOI: 10.1155/2015/767182)

[15] Wei Zhang, Fulong Zhu*, Honghai Zhang, Sheng Liu, “An Adjustable Sensitivity Shadow Moiré Technique for Surface Morphology Measurement”, Journal of Modern Optics, v61, n8, p641-649, 2014. (SCI, EI, DOI: 10.1080/09500340. 2014. 904941)

[16] Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, “Warpage measurement of silicon wafers of various bonding areas”, in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT-HDP.2012.6474814)

[17] Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064)

[18] Ying Li, Fulong Zhu*, Yanming Chen, Ke Duan, Kai Tang, Sheng Liu, “Analysis of insertion force of electric connector based on FEM”, 2014 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA2014p195-198, 2014. (EI, DOI: 10.1109/IPFA.2014.6898160)

[19] Ke Duan, Fulong Zhu*, Kai Tang, Liping He, Yanming Chen, Sheng Liu, “Effect of Chirality and Number of Graphene Layers on the Mechanical Properties of Graphene-Embedded Copper Nanocomposites”, Computational Materials Science, v117, p294-299, 2016.(SCI, EI, DOI: 10.1016/j.commatsci.2016.02.007)

[20] Fulong Zhu*, Ke Duan, Liping He, Kai Tang, Ying Li, Sheng Liu, “Effects of Chirality and Position of Graphene on the Bending Properties of Graphene-Embedded Copper Nanocomposites”, Journal of Nanoscience and Nanotechnology, Vol.17. Issue 5, p3105-3110, 2017 (SCI,EI, DOI: 10.1166/jnn. 2017. 13040)

[21] Ke Duan, Fulong Zhu*, Ying Li, Kai Tang, Sheng Liu, Yanming Chen, “Contact Resistance Investigation of Electrical Connector with Different Shrink Range”, in 2014 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1146-1149, 2014. (EI, DOI:10.1109/ICEPT.2014. 6922846)

[22] Ke Duan, Fulong Zhu*, Mingxiang Chen, Ying Li, Yanming Chen, “Warpage Analysis of DBC Substrate based on Non-contact Shadow Moiré Technology”, 2014 The 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1427-1430,2014.( EI, DOI: 10.1109/ICEPT.2014.6922923)

[23] Kai Tang, Fulong Zhu*, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Effect of Defects on Thermal Conductivity of Graphene”, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, p592-595, 2014. ( EI, DOI: 10.1109/ICEPT.2014.6922725)

[24] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao, Sheng Liu, “Molecular Dynamics Simulation on Thermal Conductivity of Single-Walled Carbon Nanotubes”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p583-586, 2013.( EI, DOI: 10.1109/ICEPT.2013.6756538)

[25] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao , Xiahui Chen, Sheng Liu, “Effect of Vacancy Defects on Thermal Conductivity of Single-walled Carbon Nanotube”, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC2013, p817-820, p2013. ( EI, DOI: 10.1109/EPTC. 2013.6745835)

[26] Fulong Zhu*, Kai Tang, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Heat conduction study across metal/graphene interface by molecular dynamics”, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC2014, p833-836, 2014. ( EI, DOI: 10.1109/EPTC.2014.7028411)

[27] Simin Wang, Xing Chen, Sheng Liu, Fulong Zhu, Xiaogang Liu,  “Estimation of homogenized Young's modulus of silicone/phosphor composite considering random dispersion and size variation of phosphor particles”, Journal of Composite Materials, v50, n14, p1981-1988, 2015. (SCI,EI, DOI:10. 1177/0021998315597992)

[28] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “The effect of temperature on compressive mechanical behavior of SWCNT-Ni”, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p633-636, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012. 6474697)

[29] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “Compressing Deformation Investigation of Single-Walled Carbon Nanotube Coated with Ni”the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, p728-731, 2012. ( EI, DOI:10.1109/EPTC. 2012.6507178)

[30] Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, “Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p579-582, 2013. (EI, DOI: 10.1109/ICEPT. 2013.6756537)

[31] Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu, “Mechanical Properties Investigation of Graphene Coated with Ni” the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, p756-759,2013.( EI, DOI: 10.1109/EPTC.2013.6745822)

[32] Hengyou Liao, Fulong Zhu*, Sheng Liu, “Mechanical stretching behavior simulation of SWCNT and SWCNT-Ni”, 2011 International Symposium on Advanced Packaging Materials, APM 2011, p85-90, 2011. (EI, DOI: 10.1109/ISAPM.2011.6105677)

[33] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Tensile behaviors investigation of SWCNT-Ni with vacancies”2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p294-297, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012.6474621)

[34] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics”. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p1155-1158, 2012. (EI, DOI: 10.1109/ICEPT-HDP.2012.6474812)

[35] Shao Song, Fulong Zhu*, Wei Zhang, Sheng Liu, “Warpage measurement of various substrates based on white light shadow Moiré technology”, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011, p389-392, 2011. (EI, DOI:10.1109/IMPACT. 2011.6117161)

[36] Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu, “Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules”, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011, p1183-1189, 2011. (EI, DOI: 10.1109/ECTC.2011.5898660);

[37] Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Sheng Tao, “Mechanical Properties Investigation of PMMA PC and PS during Thermal Nanoimprinting”, 2008 4th International Symposium on Precision Mechanical Measurements, v7130, 2008. (EI,DOI: 10.1117/12.819561)

[38] Fulong Zhu*, Shao Song, Wei Zhang, Sheng Liu, “Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5” 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, p195-198, 2010.(EI, DOI: 10.1109/ICEPT.2010.5582445)

[39] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Microstructures and Tensile Properties of a Sn-Cu Lead-free Solder Alloy”, Journal of Materials Science: Materials in Electronics, v17, n5, p379-384, 2006.( SCI, EI, DOI: 10.1007/s10854-006-7474-3)

[40] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “the Effect of Temperature and Strain Rate On the Tensile properties of a Sn99.3Cu0.7(Ni) Lead-free Solder Alloy”, Microelectronic Engineering, v84, n1, p144-150, 2007.( SCI, EI, DOI: 10.1016/j.mee.2006.09.031)

[41] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Effects of Temperature and Strain Rate on Mechanical property of Sn96.5Ag3Cu0.5”, Journal of Alloys and Compounds, v438, n1-2, p100-105, 2007.( SCI, EI, DOI: 10.1016/j.jallcom.2006.08.009)

[42] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7, 2005 6th International Conference on Electronics Packaging Technology, p1-5, 2005.(EI, DOI: 10.1109/ICEPT.2005.1564686)

[43] Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, “Mechanical Properties of a Lead-Free Solder Alloys”, 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v 2005, p107-112, 2005.( EI, DOI: 10.1109/AGEC.2005.1452326)

[44] ZHU Fu-long*, WANG Zhi-yong, GUAN Rong-feng, WANG Xue-fang, ZHANG Hong-hai, LIU Sheng, “Single Axis Mini-Tester of Mechanical Property for Micro-Specimen”, The 3rd International Symposium on Instrumentation Science and Technology (ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0562-0568.ISTP

[45] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5”, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits  (IPFA 2006), p 239-243, 2006.( EI, DOI: 10.1109/IPFA.2006.251038)

[46] Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, Sheng Liu, “Mechanical properties investigation of a SnAg solder”, Proceedings of 2005 International conference on electronics packaging, TokyoJapanApril 13-15, 2005, pp.208-213.(ISTP)

[47] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Creep Behaviors of a Lead-free Solder Alloy Sn96.5Ag3.5”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-6, 2006. ( EI, DOI: 10.1109/ICEPT.2006.359866)

[48] Rongfeng Guan, Fulong Zhu, Zhiyin Gan, Huang Dexiu , Sheng Liu, “Stress birefringence analysis of polarization maintaining optical fibers”, Optical Fiber Technology, v11, n3, p240-254, 2005.(EI, DOI: 10.1016/j.yofte.2004.10.002)

[49] Wang Zhiyong, Zhu Fulong, ZHANG Hong-hai, LIU Sheng, GUAN Rong-feng, “A Six-axis Mechanical Tester for Microspecimens”, The 3rd International Symposium on Instrumentation Science and Technology(ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0535-0540.ISTP

[50] Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Huang Dexiu, “Study on plasma cleaning and strength of wire bonding”, 2004 International Conference on the Business of Electronic Product Reliability and Liability ( EPRL), p65-71, 2004.( EI,)

[51] Guan Rongfeng, Gan Zhiyin, Zhu Fulong, Liu Sheng, Wang Xuefang, “Anodic bonding study on vacuum micro sealing cavity”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-4, 2006. (EI, DOI: 10.1109/ICEPT.2006.359851)

[52] 陈四海, 汪殿民, 朱福龙, 徐涌, 易新建. 微型柔性剪切应力传感器的制作研究. 传感器技术, 2005(8) , 81-85

[53] 刘文明, 王志勇, 鲍剑斌, 汪学方, 关荣锋, 朱福龙, 刘胜. 微陀螺仪的真空回流真空封装工艺研究. 微细加工技术,April ,2006, p61-64.

获得软件版权:

1.封装材料数据库系统    V1.0 2004SR11907(登记号)

2. MEMS封装模拟与仿真库 V1.0 2005SR04366(登记号)

3.基于声光效应的超声功率测量系统UPMS V1.0 2018SR475170 (登记号)

4.宁波市电缆隧道渗水红外检测系统CTSIS V1.0 2017SR176828 (登记号)

专    利:

发明专利

1. 朱福龙,陈炎明,何黎平,段科,潘永军,陶加全,蔺欣欣,“一种超声波功率测量系统”, 发明专利,专利号:ZL201610165674.0

2. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海,“一种基于投影莫尔原理的共面度测量系统”,发明专利,专利号:ZL 201010548868.7

3. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海,“一种基于投影莫尔原理的BGA共面度测量系统”, 发明专利,专利号:ZL 201010548877.6

4. 朱福龙,潘永军,陶加全,蔺欣欣,何黎平,段科,“一种基于超声光栅的共面度测量系统”, 发明专利,专利号:ZL201610103818.5

5. 张鸿海,刘华勇,舒霞云,徐裕力,肖峻峰,朱福龙,张丰,王永先.“一种高粘度流体微量喷射点胶装置”,发明专利,专利号:ZL200710168669.1

实用新型专利

1. 朱福龙,潘永军,陶加全,蔺欣欣,何黎平,段科,“一种基于超声光栅的共面度测量系统”,实用新型专利,专利号:ZL2016101038185.X

2.朱福龙,陶加全,潘永军,蔺欣欣,何黎平,段科,“一种软材料力学性能测量装置”,实用新型专利,专利号:ZL201620299523.5

3.朱福龙,王烽人,施浪,蔺欣欣,潘永军,王淼操,刘肖剑,徐伊昕,“一种电缆隧道缺陷无损快速检测装置”,实用新型专利,专利号:ZL201820212440.7

4. 陈炎明,朱福龙, 何黎平,段科, 潘永军, 陶加全,蔺欣欣,“一种基于声光效应的超声波功率测量系统”,实用新型专利,专利号:ZL201620224313.X

5. 朱福龙,宋劭,张伟,刘胜,“一种利用分形理论优化加热结构的环境加热炉”,实用新型专利,专利号:ZL 201120031410.4

6. 朱福龙,宋劭,张伟,刘胜,“一种用于微电子封装材料测试的环境加热炉”,实用新型专利,专利号:ZL 2011 2 0031369.0

7. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海,“一种基于投影莫尔原理的BGA共面度测量系统”, 实用新型专利,专利号:ZL 20102 0612724.9

8. 朱福龙,宋劭,张伟,刘胜,王志勇,张鸿海,“一种基于投影莫尔原理的共面度测量系统”,实用新型专利,专利号:ZL 201020612694.1

9. 王志勇,刘胜, 张鸿海, 史铁林, 汪海英, 汪学方, 朱福龙,“一种用于微小样品的六轴力学性能测量装置”,实用新型专利,专利号:ZL03237264.7

10. 张鸿海,刘华勇,舒霞云,徐裕力,肖峻峰,朱福龙,张丰,王永先.“一种高粘度流体微量喷射点胶装置”, 实用新型专利,专利号:ZL200720088827.8

主持科研项目:

1.项目名称:关键封装设备、材料应用工程-封装翘曲测量设备的研发和产业化

   任务来源:国家02重大专项课题(2009ZX02010-041子课题)

   起止年月:2010.01-2012.12

2.项目名称:碳纳米管增强无铅互连焊点的界面可靠性研究

   任务来源:中央高校基本科研业务费资助项目(2011TS066)

   起止年月:2011.6-2012.12

3.项目名称:振动对航电产品电连接器的接触电阻影响分析研究

   任务来源:国防航空基金(20120279004)

   起止年月:2012.10-2014.10

4.项目名称:微振动条件下航电产品电连接器的接触可靠性研究

   任务来源:中央高校基本科研业务费资助项目(2013TS023)

   起止年月:2013.6-2014.12

5.项目名称:基于声光效应的超声功率测量技术研究

   任务来源:企业委托研究项目(2011TS066)

   起止年月:2013.6-2014.12

6.项目名称:第三代半导体封装和系统失效机理与可靠性快速寿命方法研究--材料模型建立,数据处理方法开发(子课题)

   任务来源:国家863计划项目子课题

   起止年月:2015.01-2017.12

7. 项目名称:基于红外热像法的电缆隧道缺陷检测技术研究

   任务来源:国家电网(横向)

   起止年月:2015. 10-2017.09

8. 项目名称:含硅通孔结构晶圆减薄中的表面/界面微结构演化研究

   任务来源:国家自然科学基金(面上项目)

   起止年月:2017.01-2020.12

9. 项目名称:异质微结构表面差异性同步去除与晶圆减薄新原理

   任务来源:国家973项目子课题(2015CB057203)

   起止年月:2015.1-2019.12

10.项目名称:MEMS微机械陀螺典型微结构的尺度效应研究

   任务来源:国防航空基金(20160279003)

   起止年月:2017.01-2018.12

 

参加科研项目:

1. 项目名称:气密MEMS封装工艺及规范。

   任务来源:国家863计划项目(2002AA430030)。

   起止年月:2002.12-2003.12

2. 项目名称:封装材料特性测试及数据库

   任务来源:国家863计划项目MEMS重大专项(2003AA404016)。

   起止年月:2003.6-2004.12

3. 项目名称:面向石化等重要行业MEMS压力传感器制造与实用化研究。

   任务来源:国家863计划项目(2004AA404221)。

   起止年月:2004.10-2005.12

4. 项目名称:低成本、高性能真空熔焊封装关键技术与装备的研究

   任务来源:国家863计划项目(2005AA404260)

   起止年月:2005.7-2006.6

5. 项目名称:基于荷花效应的MEMS功能表面仿生研究

   任务来源:国家自然基金项目(50475137)

   起止年月:2005.01-2007.12

6. 项目名称:基于电磁流体动力学的金属焊料微喷射技术的研究

   任务来源:国家自然基金项目(50775087)

   起止年月:2008.01-2010.12

7. 项目名称:系统级封装的基础研究-热管理与热应力

   任务来源:国家973项目子课题(2009CB320203)

   起止年月:2009.02-2013.2

8. 项目名称:汽车胎压微传感器及系统

   任务来源:国家863计划项目子课题

   起止年月:2008.06-2010.12

9. 项目名称:高密度三维系统封装关键技术研究

   任务来源:国家02重大专项课题(2009ZX02038)

   起止年月:2010.01-2012.12

10. 项目名称:先进封装工艺开发及产业化

   任务来源:国家02重大专项课题(2009ZX02024-09)

   起止年月:2010.01-2012.12

11. 项目名称:基于TSV的三维封装关键技术

   任务来源:国家02重大专项课题

   起止年月:2010.01-2012.12

12. 项目名称:MEMS器件规模封装技术基础研究

   任务来源:国家02重大专项课题

   起止年月:2010.9-2015.09

13.  项目名称:耐高温微系统封装技术

   任务来源:装发预研基金重点项目

   起止年月:2018.01-2020.12

获奖情况:

1. 获奖项目:系统封装、测试的若干关键技术及装备

   奖项级别:电子信息技术奖(二等),

   授奖部门:中国电子学会

   获奖年月:2009.12

2. 获奖项目:系统封装、测试的若干关键技术及装备

   奖项级别:科技发明一等奖;

   授奖部门:中国物流与采购联合会

   获奖年月:2009.11

3. 获奖项目:高精度一维测试台结构设计及试验

   奖项级别:湖北省优秀学士学位论文-指导教师;

   授奖部门:湖北省教育厅、学位办

   获奖年月:2009.2

4. 获奖项目:胶囊内窥镜的磁导航式运动检测台设计

   奖项级别:湖北省优秀学士学位论文-指导教师;;

   授奖部门:湖北省教育厅、学位办

   获奖年月:2010.2

5. 获奖项目:微型胶囊机器人结构设计

   奖项级别:湖北省优秀学士学位论文-指导教师;

   授奖部门:湖北省教育厅、学位办

   获奖年月:2012.12