吴豪
  •        姓名:吴豪

           电话:027-87551914

           职称:研究员

           邮箱:hwu16@hust.edu.cn

     

个人基本情况

   吴豪(Wu Hao男,2003年9月进入华中科技大学机械设计制造及其自动化专业学习,2012年从美国佐治亚理工学院(Georgia Institute of Technology)机械工程系获得博士学位,专业方向为制造工程。自2013年3月起在美国英特尔公司(Intel Corporation)电子封装测试技术研发部(Assembly Test Technology Development, ATTD)任工艺研发高级工程师(Senior Process T/D Engineer),从事2.5D和3D高性能电子封装工艺装备的研发工作。2016年6月回到华中科技大学从事教学科研工作。

    在材料领域权威期刊Advanced Materials及系列,制造工程领域权威期刊ASME Transaction系列等期刊和重要学术会议发表学术论文二十余篇,研究成果被Advanced Science News, Materials Views China等媒体亮点报道,获得中国和美国专利三项。    

    担任精密制造领域知名期刊Precision Engineering(2016年影响因子2.237,制造工程SCI Q1区) 副主编(Associate Editor,2015-19). IEEE会员,ASME会员,MRS会员,中国机械工程学会高级会员。获得制造工程师学会杰出青年制造工程师奖(SME OYME, 2016)和英特尔杰出发明奖(Intel Distinguished Invention Award, 2013/2014)等奖励。


主要研究方向

柔性电子器件与集成及其在机器人、人体健康监测与治疗中的应用

微米、纳米机器人

开设课程

近年的科研项目、专著与论文、专利、获奖

研究项目:

1.  国家自然科学基金委“共融机器人”重大研究计划培育项目,面向人机交互的可拉伸肌电传感阵列系统设计与集成,67万,在研,主持

2.   数字制造装备与技术国家重点实验室开放课题,面向柔性混合电子的“柔硅片”技术研究,30万,在研,主持

 

荣誉与奖励:

1.  制造工程师学会(Society of Manufacturing Engineers, SME)杰出青年制造工程师奖(Robert J. Hocken Outstanding Young Manufacturing Engineer Award)SME, 2016/03, (SME官方网站报道SME OYME链接:http://www.sme.org/2016-SME-Recognizes-2016-Outstanding-Young-Manufacturing-Engineers/)


 

代表性著作:

1.     Wu, H.*, Huang, Y.A., Xu, F., Duan, Y., Yin, Z., Energy harvesters for wearable and stretchable electronics: from flexibility to stretchability, Advanced Materials. 2016, 28, 9881-9919.

2.     Wu, H., Gao, W., Yin, Z., Materials, devices and systems of soft bioelectronics for precision therapy, Advanced Healthcare Materials, 2017, 6, 170017. (Featured as journal cover, highlighted by Advanced Science News, MaterialsViewsChina).

3.     Wu, H.*, Yang, C., and Melkote, S.N., Modeling and analysis of interaction between grits and silicon in diamond wire sawing, International Journal of Advanced Manufacturing Technology. 2015, 84(5): 907-913.

4.     Wu, H. *, Wire sawing technology: A state-of-the-art review, Precision Engineering. 2015, 43: 1-9.

5.     Wu, H. *, and Melkote, S.N., Analysis of handling stresses in thin silicon solar wafers generated by a rigid vacuum gripper, ASME Journal of Manufacturing Science and Engineering. 2015, 138(3), 034501.

6.     Wu, H., Yang, C. ,and Melkote, S.N., Effect of reciprocating wire slurry sawing on surface quality and mechanical strength of as-cut solar silicon wafers, Precision Engineering. 2014, 38: 121-126.

7.     Wu, H., and Melkote, S.N., Effect of crystal defects on mechanical properties relevant to cutting of multicrystalline solar silicon, Materials Science in Semiconductor Processing. 2013, 16(6): 1416-1421.

8.     Wu, H. *, Melkote, S., and Danyluk, S., Effects of carbide and nitride inclusions on diamond scribing of multicrystalline silicon for solar cells, Precision Engineering. 2013, 37(2):500-504.

9.     Wu H., Melkote S. , and Danyluk S., Mechanical strength of silicon wafers cut by loose abrasive slurry and fixed abrasive diamond wire sawing, Advanced Engineering Materials.2012, 14(5): 342-348.

10.  Wu, H., and Melkote, S., Effect of crystallographic orientation on ductile scribing of crystalline silicon Role of phase transformation and slip, Materials Science and Engineering: A. 2012, 549:200-205.

11.  Wu, H., and Melkote, S., Study of ductile-to-brittle transition in single grit diamond scribing of silicon: Application to wire sawing of silicon wafers, ASME Journal of Engineering Materials & Technology, 2012, 13,041011.