李俊杰
  •       姓名:李俊杰

          电话:18672761660

          职称:博士后

          邮箱:junjieli@hust.edu.cn


个人基本情况

 李俊杰(Li JunjiePostdoctor19886月出生,湖北孝感人。201712月博士毕业于华中科技大学机械制造及其自动化专业,获工学博士学位,同年进入博士后流动站工作。主要从事大规模微纳结构制备与应用,微电子封装等方面研究工作。目前已在Journal of Alloys and CompoundsNanoscale Research LettersMaterials Letters等期刊发表论文10余篇,授权国家发明专利1项。作为骨干成员参与973等项目。

主要研究方向

微纳制造

微电子封装

近年的科研项目、专著与论文、专利、获奖

科研项目:

1. 国家重点基础研究发展计划项目(973计划):20/14nm集成电路晶圆级三维集成制造的基础研究,课题五:多场作用下三维密排阵列微互连结构形成及性能调控(No. 2015CB057205)。在研,主要参与人。

2. 长江学者和创新团队发展计划:微纳米制造与纳米测量技术(IRT13017)。已结题,主要参与人。

3. 长江学者和创新团队发展计划:微纳制造与纳米测量技术(IRT_17R44)。在研,主要参与人。


代表性著作:

1. Junjie Li, Chaoliang Cheng, Tielin Shi, Jinhu Fan, Xing Yu, Siyi Cheng, Guanglan Liao, Zirong Tang. Surface effect induced Cu-Cu bonding by Cu nanosolder paste, Materials Letters, 184 (2016) 193-196.

2. Junjie Li, Xing Yu, Tielin Shi, Chaoliang Cheng, Jinhu Fan, Siyi Cheng, Guanglan Liao, Zirong Tang. Low-Temperature and Low-Pressure Cu-Cu Bonding by Highly Sinterable Cu Nanoparticle Paste, Nanoscale Research Letters, 255 (2017) 1-6.

3. Junjie Li, Xing Yu, Tielin Shi, Chaoliang Cheng, Jinhu Fan, Siyi Cheng, Tianxiang Li, Guanglan Liao, Zirong Tang. Depressing of Cu-Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles, Journal of Alloys and Compounds, 709 (2017) 700-707.

4. Junjie Li, Tielin Shi, Chen Feng, Qi Liang, Xing Yu, Jinhu Fan, Siyi Cheng, Guanglan Liao Zirong Tang. The novel Cu nanoaggregates formed by 5 nm Cu nanoparticles with high sintering performance at low temperature, Materials Letters, 216 (2018) 20–23.

5. Chaoliang Cheng, Junjie Li, Tielin Shi, Xing Yu, Jinhu Fan, Guanglan Liao, Xiaoping Li, Siyi Cheng, Yan Zhong, Zirong Tang. A novel method of synthesizing antioxidative copper nanoparticles for high performance conductive ink, Journal of Materials Science: Materials in Electronics, (2017) 1-9.

6. Xing Yu, Junjie Li, Tielin Shi, Chaoliang Cheng, Guanglan Liao, Jinhu Fan, Tianxiang Li, Zirong Tang. A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics, Journal of Alloys and Compounds, 724 (2017) 365-372.


荣誉与奖励:

1. 2014年华中科技大学优秀研究生干部

2. 2016年,IEEE 67th ECTC Student Travel Award(封装届顶级会议,全球仅8人获奖)

3. 2017年华中科技大学知行奖学金