刘长清

师资队伍

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刘长清教授

电　　话

邮　　箱lcq5563@hust.edu.cn

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个人简介

       刘长清（Liu Changqing, Professor）， 1998年博士毕业于英国赫尔大学工程设计与制造专业。1997-2000年在英国伯明翰大学高性能材料跨学科研究中心担任博士后研究员。2000-2023年在英国拉夫堡大学机械、电器和制造工程学院先后担任博士后研究员、讲师、高级讲师和教授职务。自2023年10月任华中科技大学机械科学与工程学院教授，博士生导师。
       长期从事先进电子材料和制造技术的创新研究，包括半导体芯片器件异构集成，互连，封装及可靠性、互连界面特性及键合机理、电化学沉积互连凸点、功率电子及宽带半导体集成与封装、生物电子和智能可穿戴电子等相关的研究工作。迄今为止在相关领域国际材料及先进制造期刊 Materials & Design, Acta Materialia，Carbohydrate Polymers 等发表了300多篇学术论文。主持参与了若干科研项目。曾担任英国国家动力电子研究中心和创新电子制造中心主要项目负责人，欧盟微纳多元材料多功能微型器件制造项目总负责。与世界各地包括帝国理工、伦敦大学国王学院、诺丁汉大学、曼彻斯特大学、新加坡南洋理工大学、香港城市大学等约30所院校、研究机构合作交流，指导了近40名博士生。他是英国高等教育学院院士、英国大学教授（工程）委员会资深会员、美国电器电子工程师协会（IEEE）资深会员、曾任IEEE协会电子封装(EPS) 领域旗舰电子元件和技术国际会议（ECTC）的电子互连委员会主席。曾先后受聘于哈尔滨工业大学、新加坡南洋理工大学、华中科技大学和香港城市大学(由英国皇家协会资助和任命)国际知名大学的客座教授。

研究方向

       半导体元器件异构集成及制造技术：电子封装材料及制备；铜互连及其应用；电子互连界面特性、力学行为与可靠性； “绿色”可持续电子制造。
       严酷服役条件下的电子互连材料及制造技术：高温互连材料，制造及应用；低温电子互连材料和制备；严酷环境下热-电-机械耦合可靠性分析及失效机理。
       宽带半导体集成互连和热管理优化：功率电子宽带半导体先进互连材料与制程优化 (die-attach, substrate-attach)；高温扩散障、热界面材料制备及系统热管理优化。
       生物及智能可穿戴电子异质集成技术：生物电子界面材料和制备；打印/柔性/有机电子相关材料及制造技术；电-生物-多材料多功能系统集成； 3D增材构建多功能复合仿生组织。

开设课程

科研项目

论文专著与专利

代表性期刊论文：
[1] Zhang L, Zhao H, S Liang S, Liu C *， “Heat transfer in phase change materials for integrated batteries and power electronics systems”, Applied Thermal Engineering, 232, September 2023, pp.120997-120997, ISSN: 1359-4311. https://doi.org/10.1016/j.applthermaleng.2023.120997

[2] Chen Y, Liu C, Zhou Z, Liu C*, “Transient liquid phase bonding with Ga-based alloys for electronics interconnections”, Journal of Manufacturing Processes, Volume 84, December 2022, Pages 1310-1319, https://doi.org/10.1016/j.jmapro.2022.11.005

[3] Liu C, Liu A, Jiang H, Liang S, Zhou Z, Liu C*, “Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging”, Microelectronics reliability,  Volume 138, November 2022, 114688, https://doi.org/10.1016/j.microrel.2022.114688

[4] Jiang H, Robertson S, Liang S, Zhou Z, Zhao L, Liu C*,  “Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite”, Materials Today Communications, Volume 33, December 2022, 104623, https://doi.org/10.1016/j.mtcomm.2022.104623

[5] Ramachandran S, Zhong Y, Robertson S, Panteli C, Liang S, Wu F, Zhou R, Marathe S, Zhou Z, Holmes AS, Haigh SJ*, Liu C*, Wajira Mirihanage*, “Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding”, Materialia, Volume 23, June 2022, 101444. https://doi.org/10.1016/j.mtla.2022.101444

[6] Liu C, Liu A, Su Y, Chen Y, Zhou Z, Liu C*, “Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects”, Journal of Manufacturing Processes, Volume 73:139-148, January 2022. https://doi.org/10.1016/j.jmapro.2021.10.065

[7] Su Y, Fu G, Liu C*, Zhang K, Zhao L, Liu C, Liu A, Song J, “Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores”, Computer Methods in Applied Mechanics and Engineering 378: 113729, 01 Mar 2021. https://doi.org/10.1016/j.cma.2021.113729

[8] Zhu W, Wang X, Liu C*, Zhou Z, Wu F, “Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bonding”,  Materials & Design, 174:107781,  06 April 2019. https://doi.org/10.1016/j.matdes.2019.107781

[9] R. Rebelo AM, Liu Y, Liu C*, Schäfer K-H, Saumer M, Yang G, “Carbon Nanotube-Reinforced Poly(4-vinylaniline)/Polyaniline Bilayer-Grafted Bacterial Cellulose for Bioelectronic Applications”,  ACS Biomaterials Science & Engineering 5(5):2160-2172, 13 May 2019, https://doi.org/10.1021/acsbiomaterials.9b00039

[10] Rebelo A, Liu Y, Liu C*, Schäfer KH, Saumer M, Yang G. “Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose membranes as bioelectronics interfaces”, Carbohydrate Polymers 204:190-201, 15 Jan 2019, https://doi.org/10.1016/j.carbpol.2018.10.017 

[11] Liu, L., Chen, Z., Zhou, Z., Chen, G., Wu, F., Liu, C*. “Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects”, Journal of Alloys and Compounds, Volume 722:746-752, 25 Oct 2017.

[12] Chen, Z., Zhang, X*., Chen, P., Li, W., Zhou, K., Shi, L., Liu, K., Liu, C*. “3D multi-nozzle system with dual drives highly potential for 3D complex scaffolds with multibiomaterials”,  International Journal of Precision Engineering and Manufacturing, 18:755-761, 09 May 2017.

[13] Chen, Z., Zhang, X*., Yang, Y., Zhou, K., Wragg, N., Liu, Y., Lewis, M., Liu, C*. “Fabrication and characterization of 3D complex hydroxyapatite scaffolds with hierarchical porosity of different features for optimal bioactive performance”, Ceramics International, Part A, Volume 43: 336–344, January 2017.

[14] Gao, X., Shi, Z., Kuśmierczyk, P., Liu, C., Yang, G., Sevostianov, I., Silberschmidt, VV*. “Time-dependent rheological behaviour of bacterial cellulose hydrogel”, Materials Science and Engineering: C, Volume 58: 153–159, 1 January 2016.

[15] Zhao, W., Shi, Z., Chen, X., Yang, G., Lenardi, C., Liu, C*.  “Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compression”,  Composites Part B: Engineering, Volume 76, July 2015, Pages 292–299.

[16] Lim, YY*., Goh, YM., Liu, C*., Hutt, DA. “Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces”, Surface and Coatings Technology, Volume 266, 25 March 2015, Pages 93-104.

[17] Tian,Y*., Liu, C*., Hutt, DA ,Stevens,B, “Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection”, Journal of Electronic Materials, 43(2), 01st February 2014, 594-603.

[18] Zhao, W., Liu,  C*., Wu, F., Lenardi, C*. “An investigation on the mechanical behaviour of poly(2-hydroxyethyl methacrylate) hydrogel membrane under compression in the assembly process of microfluidic system”,  Journal of Polymer Science Part B: Polymer Physics, 52, 2014, pp.485-495.

[19] Xiong, Z., Dong, C., Cai, H., Liu, C*., Zhang, X.,  “Composite inks of poly(3,4-ethylenedioxythiophene)/poly(styrenesulfonate)/silver nanoparticles and electric/optical properties of inkjet-printed thin films”,  Materials Chemistry and Physics, 141, 2013, pp416-422.

[20] Lim, Y*., Goh, YM., Liu, C*. “Surface Treatments for Inkjet Printing onto a PTFE-based Substrate for High Frequency Applications", Industrial & Engineering Chemistry Research, 52, 2013, pp11564−11574.

[21] Zhang, Y., Liu, C*., Whalley, DC., “The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers”, Appl. Phys. Lett. 102, 2013, pp103303.

[22] Xiong, Z., Liu, C*. “Optimisation of inkjet printed PEDOT:PSS thin films through annealing processes”, Organic Electronics,  Volume 13, Issue 9, September 2012, Pages 1532–1540.

[23] Williams, O*., Webb, DP., Liu, C*., Firth, P. “Evaluation of contamination of ceramic surfaces and its effect on epoxy bleed.” International Journal of Adhesion & Adhesives, 32 (2012)61–69.

[24] Cheng, X*., Liu, C*. & Silberschmidt, V.V. "Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures", Computational Materials Science, vol. 52, Issue 1, 2011, pp. 274-281.

[25] Xu, H*., Liu, C*., Silberschmidt, V.V., Pramana, S.S., White, T.J.,  Chen, Z., Acoff,  V.L. “ Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds.” Acta Materialia, 59 (2011) 5661–5673. 

[26] Xu, H*., Liu, C*., Silberschmidt, V.V., Pramana, S.S., White, T.J.,  Chen, Z., Acoff,  V.L. “New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation.” Scripta Materialia, 65, 2011, pp 642-645.

[27] Qin, Y., Wilcox, G.D*., Liu,  C.  “Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection.”  Electrochimica Acta. 56 (2010) 183–192.

[28] Ebbens, S., Hutt, D.A., and Liu, C*. “The Thermal Stability of Alkanethiol Self-Assembled Monolayers on Copper for Fluxless Soldering Applications”, IEEE Transactions on Components and Packaging Technologies, 33(2), June 2010, pp251-259.

[29] Hin, T.Y., Liu, C*., Conway,P.P., Yu, W., Cargill, S., Desmulliez,M.P.Y. “Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithography”, IEEE Photonics Technology Letters, 22(13), July 2010, pp 957-959.

[30] Williams, O*., Liu, C*., Webb, D.P. and Firth, P. ''Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies'', International Journal of Adhesion and Adhesives, 30(4), June 2010, pp 225-235.

[31] Knauf, B.J*., Webb, D.P., Liu, C*. and Conway, P.P., ''Low frequency induction heating for the sealing of plastic microfluidic systems'', Microfluidics and Nanofluidics, November 2009, 243-252. 

[32] Gong, J*., Liu, C*., Conway, P.P. and Silberschmidt, V. ‘’Initial formation of Cu-Sn intermetallic compounds between molten Sn-Ag-Cu solder and Cu substrate’’, Scripta Materialia, 60, 2009, pp 333-335. 

[33] ebb, D.P*., Knauf, B., Liu, C., Hutt, D.A., Conway, P.P.,  “Productionisation issues for commercialisation of microfluidic based devices”, Sensor Review, 29(4) 2009: 349-354.

[34] ong, J*., Liu, C*., Conway, P.P. and Silberschmidt, V. ''Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate'', Acta Materiala, Volume 56, Issue 16, 4291-4297, June 2008.

[35] hen, K*., Liu, C*.,  Whalley, D.C., Hutt, D.A., Li, J.F., Mannan, S.H. “A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin” Acta Materialia 56 (2008) 5668–5676. (8).

[36] Hutt, D.A*. and Liu, C. ''Oxidation Protection of Copper Surfaces using Self-assembled Monolayers of Octadecanethiol'', Applied Surface Science, 2522, 15th October 2005, 400-411.

荣誉获奖

2015: Chair of ‘Interconnections’ committee of ECTC - IEEE EPS flagship conference, USA.
2012: Royal Society Kan Tong Po Visiting Professor of City University of Hong Kong, China.
2011: Guest Professor of Huazhong University of Science and Technology, China.
2010: Two student travel grant awards of ECTC attendance, Las Vegas, USA.
2009: Best Student Paper Award at ICEPT Tsinghua University, Beijing, China.
2007: Visiting Professor of Nanyang Technical University, Singapore. 
2005: Visiting Professor of Harbin Institute of Technology, China.
2003: The Best Paper Award at the 28th IEMT (SEMI, IEEE/CPMT), San Jose, USA.
2003: Cookson Electronics Paper Award at 5th EMAP (IEEE/CPMT), Singapore. 
1993:  Overseas Research Students (ORS) Awards, CVCP, UK.

师资队伍

刘长清教授

个人简介

研究方向

开设课程

科研项目

论文专著与专利

荣誉获奖

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师资队伍

刘长清 教授

个人简介

研究方向

开设课程

科研项目

论文专著与专利

荣誉获奖

友情链接

关注我们

刘长清教授